DIGICRO Pte. Ltd (Singapore office:28C Stanley Street Singapore 068737, CEO Yuta Nagano, Hereinafter called Digicro) was selected to join the Summer/ Fall 2019 Batch acceleration program ogranized by Plug and Play Japan, which will be carried out from June 2019 to September 2019.
Digicro provides micro loans of 50 up to 1,000 USD to the unbanked people in Cambodia through its mobile app Spean Loan. Digicro applies machine learning to assess the borrowers’ ability to repay loan by collecting alternative data from their smartphones.
Users can receive and repay a loan 24/7, and loan can be disbursed within 5 minutes after downloading the app. Since its launch in April 2019, Digicro has disbursed 50,000 USD with over 12,000 installs.
Plug and Play is the world’s leading global venture capital/accelerator which supports startups with innovative ideas and technologies together with large corporations. Plug and Play Japan was incorporated in July 2017 as a base of business development in Japan. Former acceleration program, “Batch 2”, we supported 59 domestic and overseas startups together with 22 large domestic corporate companies as official partners.
The program, also called as Batch, is to provide support for domestic and overseas startups develop globally, focusing on 5 verticals (IoT, Fintech, Insurtech, Mobility, and Brand & Retail) together with official partners of Plug and Play Japan.
Press release from Plug and Play Japan